Device having a conductive light absorbing mask and method for fabricating same

ABSTRACT

A system and method for an optical component that masks non-active portions of a display and provides an electrical path for one or more display circuits. In one embodiment an optical device includes a substrate, a plurality of optical elements on the substrate, each optical element having an optical characteristic which changes in response to a voltage applied to the optical element, and a light-absorbing, electrically-conductive optical mask disposed on the substrate and offset from the plurality of optical elements, the optical mask electrically coupled to one or more of the optical elements to provide electrical paths for applying voltages to the optical elements. In another embodiment, a method of providing an electrical signal to optical elements of a display comprises electrically coupling an electrically-conductive light-absorbing mask to one or more optical elements, and applying a voltage to the mask to activate the one or more optical elements.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/571,130, filed Aug. 9, 2012, issuing as U.S. Pat. No. 8,638,491,which is a continuation of U.S. patent application Ser. No. 13/251,009,filed Sep. 30, 2011, now U.S. Pat. No. 8,243,360, which is acontinuation of U.S. patent application Ser. No. 13/010,665, filed Jan.20, 2011, now U.S. Pat. No. 8,035,883, which is a continuation of U.S.patent application Ser. No. 12/426,168, filed Apr. 17, 2009, now U.S.Pat. No. 7,889,415, which is a continuation of U.S. patent applicationSer. No. 11/925,692, filed Oct. 26, 2007, now U.S. Pat. No. 7,542,198,which is a divisional of U.S. patent application Ser. No. 11/119,432,filed Apr. 29, 2005, now U.S. Pat. No. 7,420,725, which claims thebenefit of U.S. Provisional Patent Application No. 60/613,480, titled“Device Having A Conductive Light Absorbing Mask and Method forFabricating Same,” filed Sep. 27, 2004. The disclosures of all theabove-referenced prior applications, publications, and patents areconsidered part of the disclosure of this application, and areincorporated by reference herein in their entirety. This application isrelated to U.S. Pat. No. 6,741,377, entitled “Device Having aLight-Absorbing Mask and a Method for Fabricating Same,” filed Jul. 2,2002, which is assigned to the assignee of the present invention.

BACKGROUND

1. Field of the Invention

The field of the invention relates to microelectromechanical systems(MEMS).

2. Description of the Related Technology

Microelectromechanical systems (MEMS) include micro mechanical elements,actuators, and electronics. Micromechanical elements may be createdusing deposition, etching, and/or other micromachining processes thatetch away parts of substrates and/or deposited material layers or thatadd layers to form electrical and electromechanical devices. One type ofMEMS device is called an interferometric modulator. An interferometricmodulator may comprise a pair of conductive plates, one or both of whichmay be transparent and/or reflective in whole or part and capable ofrelative motion upon application of an appropriate electrical signal.One plate may comprise a stationary layer deposited on a substrate, theother plate may comprise a metallic membrane separated from thestationary layer by an air gap. Such devices have a wide range ofapplications, and it would be beneficial in the art to utilize and/ormodify the characteristics of these types of devices so that theirfeatures can be exploited in improving existing products and creatingnew products that have not yet been developed.

Summary of Certain Embodiments

The system, method, and devices of the invention each have severalaspects, no single one of which is solely responsible for its desirableattributes. Without limiting the scope of this invention, its moreprominent features will now be discussed briefly. After considering thisdiscussion, and particularly after reading the section entitled“Detailed Description of Certain Embodiments” one will understand howthe features of this invention provide advantages over other displaydevices.

A first embodiment includes an optical device including a substrate, anoptical element disposed on the substrate, the optical element having anoptical characteristic which changes in response to a voltage applied tothe optical element, and a light-absorbing, electrically-conductiveoptical mask disposed on the substrate and at a location that is atleast partially different than that of the optical element, the opticalmask electrically coupled to the optical element to provide one or moreelectrical paths for application of voltages to the optical element. Inone aspect of this embodiment, the optical element comprises aninterferometric modulator. In a second aspect of this embodiment, theoptical mask is configured to appear black. In a third aspect of thisembodiment, the optical mask is configured to appear a color other thanblack. In a fourth aspect of this embodiment, the device furtherincludes a column electrode electrically coupled to the mask to form anelectrically parallel connection. In a fifth aspect of this embodiment,the device further includes a row electrode electrically coupled to themask to form an electrically parallel connection. In a sixth aspect ofthis embodiment, the mask comprises a film stack. In a seventh aspect ofthis embodiment, the mask is electrically coupled to the optical elementby one or more conductive vias. In an eighth embodiment, the film stackcomprises a first reflective layer and a second reflective layer, andthe first reflective layer can be electrically connected to a firstelectrode and the second reflective layer can be electrically connectedto a second electrode. In a ninth embodiment, the first reflective layerand the second reflective layer are electrically connected to the sameelectrode.

A second embodiment includes a method of providing an electrical signalto a plurality of optical elements of a display, the optical elementsindividually actuatable by applying a voltage thereto, the methodincludes electrically coupling an electrically-conductive,light-absorbing mask to one or more optical elements, and applying avoltage to the mask to activate the one or more optical elements. In oneaspect of this embodiment, the optical elements comprise interferometricmodulators. In a second aspect of this embodiment, the mask comprises afilm stack. In a third aspect of this embodiment the mask comprises oneor more interferometric modulators. In a fourth aspect of thisembodiment, one or more of the interferometric modulators included inthe mask are static interferometric modulators. In a fifth aspect ofthis embodiment, the mask comprises a film stack.

A third embodiment includes a method of fabricating an optical device,the method including forming an electrically-conductive optical mask ona substrate, wherein the optical mask absorbs light, forming an opticalcomponent on the substrate in a location that is at least partiallydifferent than that of the optical mask, wherein the optical componenthas a driven state and an undriven state, the optical component changingbetween the driven state and the undriven state in response to anapplied voltage, each state having a characteristic optical response toincident light, and electrically connecting the optical mask to theoptical component so at least a portion of the optical mask provides abus for applying the voltage to the optical component. In one aspect ofthis embodiment, the optical component comprises an interferometricmodulator. In a second aspect of this embodiment, the optical maskcomprises one or more interferometric modulators. In a third aspect ofthis embodiment, one or more interferometric modulators are static. In afourth aspect of this embodiment, the optical mask comprises a filmstack. In a fifth aspect of this embodiment, the film stack comprises anon-light-absorbing dielectric material sandwiched between twolight-reflecting materials. In a sixth aspect of this embodiment, one ormore of the light-reflecting materials comprises silver, aluminum, orchromium.

A fourth embodiment includes a method of fabricating an optical devicecomprising at least one active optical component formed on a transparentsubstrate, the method including identifying an area on the substratethat is to be light-absorbing wherein the identified area is laterallyoffset from the at least one active optical component, and fabricating aconductive light-absorbing mask on the identified area prior tofabricating the at least one active optical component, wherein the maskis connected to the active optical component. In one aspect of thisembodiment, the optical component comprises a pixel, the light-absorbingarea being an area bordering the pixel. In a second aspect of thisembodiment, the fabricating further includes depositing a firstlight-reflecting layer on the substrate, depositing anon-light-absorbing dielectric layer on the first light-reflectinglayer, and depositing a second light-reflecting layer on the non-lightabsorbing dielectric layer, wherein one or more of the first or secondlight-reflecting layer is electrically conductive. In a third aspect ofthis embodiment, the first and second light-reflecting layers comprisemetallic materials. In a fourth aspect of this embodiment, the non-lightabsorbing dielectric layer comprises an oxide layer. In a fifth aspectof this embodiment, the pixel is defined by an interferometricmodulator. In a sixth aspect of this embodiment, the light-absorbingmask comprises a static interferometric modulator.

A fifth embodiment includes an optical device including means forreflecting incident light from an optical component, wherein the opticalcomponent has a driven state and an undriven state, the opticalcomponent changing between the driven state and the undriven state inresponse to an applied voltage, each state having a characteristicoptical response to incident light, means for absorbing light in anelectrically-conductive optical mask disposed on the substrate and at alocation that is at least partially different than that of the opticalcomponent, and means for electrically connecting the optical mask to theoptical component so at least a portion of the optical mask provides anelectrical bus for a voltage applied to the optical component.

A sixth embodiment includes an optical device produced by the processincluding identifying an area on the substrate that is to belight-absorbing wherein the identified area is laterally offset from theat least one active optical component, and fabricating a conductivelight-absorbing mask on the identified area prior to fabricating the atleast one active optical component, wherein the mask is connected to theactive optical component.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view depicting a portion of one embodiment of aninterferometric modulator display in which a movable reflective layer ofa first interferometric modulator is in a released position and amovable reflective layer of a second interferometric modulator is in anactuated position.

FIG. 2 is a system block diagram illustrating one embodiment of anelectronic device incorporating a 3×3 interferometric modulator display.

FIG. 3 is a diagram of movable mirror position versus applied voltagefor one exemplary embodiment of an interferometric modulator of FIG. 1.

FIG. 4 is an illustration of a set of row and column voltages that maybe used to drive an interferometric modulator display.

FIGS. 5A and 5B illustrate one exemplary timing diagram for row andcolumn signals that may be used to write a frame of display data to the3×3 interferometric modulator display of FIG. 2.

FIG. 6A is a cross section of the device of FIG. 1.

FIG. 6B is a cross section of an alternative embodiment of aninterferometric modulator.

FIG. 6C is a cross section of another alternative embodiment of aninterferometric modulator.

FIG. 7A is a cross-sectional side elevational view of a first exemplaryinterferometric modulator in a first state.

FIG. 7B is a cross-sectional side elevational view of theinterferometric modulator of FIG. 7A in a second state.

FIG. 7C is a cross-sectional side elevational view of second exemplaryinterferometric modulator in a first state.

FIG. 7D is a cross-sectional side elevational view of theinterferometric modulator of FIG. 7C in a second state.

FIG. 8A is a top view of a portion of an interferometric modulator arrayillustrating non-active areas containing structures included in aplurality of pixels.

FIG. 8B is a top elevational view of a portion of an interferometricmodulator array illustrating non-active areas containing structuresincluded in a plurality of pixels.

FIG. 9 shows a cross-section through a MEMS device having a mask orlight-absorbing region in accordance with one embodiment of theinvention.

FIG. 10 shows a cross-section of another embodiment of a MEMS devicehaving a mask or light-absorbing region in accordance with anotherembodiment of the invention.

FIG. 11 is a cross-sectional view illustrating various layers that canbe included in a MEMS device having a conductive mask.

FIG. 12 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating a reflective chromelayer deposited on a substrate.

FIG. 13 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating the reflective chromelayer of FIG. 12 with portions of the chrome layer removed.

FIG. 14 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating additional layersapplied to the embodiment shown in FIG. 13.

FIG. 15 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating a patterning and etchstep performed to form recesses for supports.

FIG. 16 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating forming supports inthe recesses shown in FIG. 15.

FIG. 17 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask, illustrating the result ofdepositing a mechanical membrane onto the embodiment shown in FIG. 16and removing a sacrificial layer to form an air gap.

FIG. 18 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between both layers of the mask and a movablemechanical membrane.

FIG. 19 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between both layers of the mask and a non-movableelectrode layer.

FIG. 20 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between a first reflective layer of the mask and amovable mechanical membrane.

FIG. 21 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between a first and second reflective layer of themask and a movable mechanical membrane.

FIG. 22 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between a first reflective layer of the mask and anon-movable electrode layer and another electrically parallel connectionis formed between a second reflective layer of the mask and a movablemechanical membrane.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

The following detailed description is directed to certain specificembodiments of the invention. In this description, reference is made tothe drawings wherein like parts are designated with like numeralsthroughout.

Reference in this specification to “one embodiment” or “an embodiment”means that a particular feature, structure, or characteristic describedin connection with the embodiment is included in at least one embodimentof the invention. The appearances of the phrase “in one embodiment” invarious places in the specification are not necessarily all referring tothe same embodiment, nor are separate or alternative embodimentsmutually exclusive of other embodiments. Moreover, various features aredescribed which may be exhibited by some embodiments and not by others.Similarly, various requirements are described which may be requirementsfor some embodiments but not other embodiments.

The desire to view video data on high resolution mobile device displayswhile meeting power limitations is facilitated by minimizing theresistance of the display control lines. For these and other reasons, itis desirable to increase the conductance of the signal lines whileminimizing the amount of additional passive or non-active opticalcontents in a display. The present invention discloses, in oneembodiment, a multi-purpose optical component that acts as a conductiveoptical mask, e.g., a “black mask,” to absorb ambient or stray light andto improve the optical response of a display device by increasing thecontrast ratio, and to also function as an electrical bussing layer. Insome applications, the conductive mask can reflect light of apredetermined wavelength to appear as a color other than black. Theconductive mask, also referred to herein simply as a “mask,” can beelectrically coupled to one or more of the elements on the display toprovide one or more electrical paths for voltages applied to one or moreof the display elements. For example, depending on the configurationdesired, one or more of the row or column electrodes can be connected tothe conductive mask to reduce the resistance of the connected row orcolumn electrode. In one embodiment, a MEMS display device, for example,an array of interferometric modulators, comprises a dynamic opticalcomponent (e.g., a dynamic interferometric modulator) and a staticoptical component (e.g., a static interferometric modulator) laterallyoffset from the dynamic optical component. The static optical componentfunctions as the “black mask” to absorb ambient or stray light innon-active areas of a display to improve the optical response of thedynamic optical component, and acts as an electrical bus for either arow or a column electrode of the array of interferometric modulators.For example, non-active areas can include one or more areas of a MEMSdisplay device other than the area corresponding to a movable reflectivelayer. A non-active area can also include an area of a display devicethat is not used to display an image or data rendered on the displaydevice.

Although a MEMS device, which includes an interferometric modulator,will be used to illustrate one embodiment, it is to be understood thatthe invention covers other optical devices such as various imagingdisplay and optoelectronic devices in general, which have non-activeareas which are required to be light-absorbing, but which do not includeinterferometric modulators (e.g., LED and plasma displays). As will beapparent from the following description, the invention may beimplemented in any device that is configured to display an image,whether in motion (e.g., video) or stationary (e.g., still image), andwhether textual or pictorial. More particularly, it is contemplated thatthe invention may be implemented in or associated with a variety ofelectronic devices such as, but not limited to, mobile telephones,wireless devices, personal data assistants (PDAs), hand-held or portablecomputers, GPS receivers/navigators, cameras, MP3 players, camcorders,game consoles, wrist watches, clocks, calculators, television monitors,flat panel displays, computer monitors, auto displays (e.g., odometerdisplay, etc.), cockpit controls and/or displays, display of cameraviews (e.g., display of a rear view camera in a vehicle), electronicphotographs, electronic billboards or signs, projectors, architecturalstructures, packaging, and aesthetic structures (e.g., display of imageson a piece of jewelry). MEMS devices of similar structure to thosedescribed herein can also be used in non-display applications such as inelectronic switching devices.

One interferometric modulator display embodiment comprising aninterferometric MEMS display element is illustrated in FIG. 1. In thesedevices, the pixels are in either a bright or dark state. In the bright(“on” or “open”) state, the display element reflects a large portion ofincident visible light to a user. When in the dark (“off” or “closed”)state, the display element reflects little incident visible light to theuser. Depending on the embodiment, the light reflectance properties ofthe “on” and “off” states may be reversed. MEMS pixels can be configuredto reflect predominantly at selected colors, allowing for a colordisplay in addition to black and white.

FIG. 1 is an isometric view depicting two adjacent pixels in a series ofpixels of a visual display, wherein each pixel comprises a MEMSinterferometric modulator. In some embodiments, an interferometricmodulator display comprises a row/column array of these interferometricmodulators. Each interferometric modulator includes a pair of reflectivelayers positioned at a variable and controllable distance from eachother to form a resonant optical cavity with at least one variabledimension. In one embodiment, one of the reflective layers may be movedbetween two positions. In the first position, referred to herein as thereleased state, the movable layer is positioned at a relatively largedistance from a fixed partially reflective layer. In the secondposition, the movable layer is positioned more closely adjacent to thepartially reflective layer. Incident light that reflects from the twolayers interferes constructively or destructively depending on theposition of the movable reflective layer, producing either an overallreflective or non-reflective state for each pixel.

The depicted portion of the pixel array in FIG. 1 includes two adjacentinterferometric modulators 12 a and 12 b. In the interferometricmodulator 12 a on the left, a movable and highly reflective layer 14 ais illustrated in a released position at a predetermined distance from afixed partially reflective layer 16 a. In the interferometric modulator12 b on the right, the movable highly reflective layer 14 b isillustrated in an actuated position adjacent to the fixed partiallyreflective layer 16 b.

The fixed layers 16 a, 16 b are electrically conductive, partiallytransparent and partially reflective, and may be fabricated, forexample, by depositing one or more layers each of chromium andindium-tin-oxide onto a transparent substrate 20. The layers arepatterned into parallel strips, and may form row electrodes in a displaydevice as described further below. The movable layers 14 a, 14 b may beformed as a series of parallel strips of a deposited metal layer orlayers (orthogonal to the row electrodes 16 a, 16 b) deposited on top ofsupports 18 and an intervening sacrificial material deposited betweenthe supports 18. When the sacrificial material is etched away, thedeformable metal layers are separated from the fixed metal layers by adefined air gap 19. A highly conductive and reflective material such asaluminum may be used for the deformable layers, and these strips mayform column electrodes in a display device.

With no applied voltage, the cavity 19 remains between the layers 14 a,16 a and the deformable layer is in a mechanically relaxed state asillustrated by the pixel 12 a in FIG. 1. However, when a potentialdifference is applied to a selected row and column, the capacitor formedat the intersection of the row and column electrodes at thecorresponding pixel becomes charged, and electrostatic forces pull theelectrodes together. If the voltage is high enough, the movable layer isdeformed and is forced against the fixed layer (a dielectric materialwhich is not illustrated in this Figure may be deposited on the fixedlayer to prevent shorting and control the separation distance) asillustrated by the pixel 12 b on the right in FIG. 1. The behavior isthe same regardless of the polarity of the applied potential difference.In this way, row/column actuation that can control the reflective vs.non-reflective pixel states is analogous in many ways to that used inconventional LCD and other display technologies.

FIGS. 2 through 5 illustrate one exemplary process and system for usingan array of interferometric modulators in a display application. FIG. 2is a system block diagram illustrating one embodiment of an electronicdevice that may incorporate aspects of the invention. In the exemplaryembodiment, the electronic device includes a processor 21 which may beany general purpose single- or multi-chip microprocessor such as an ARM,Pentium®, Pentium II®, Pentium III®, Pentium IV®, Pentium® Pro, an 8051,a MIPS®, a Power PC®, an ALPHA®, or any special purpose microprocessorsuch as a digital signal processor, microcontroller, or a programmablegate array. As is conventional in the art, the processor 21 may beconfigured to execute one or more software modules. In addition toexecuting an operating system, the processor may be configured toexecute one or more software applications, including a web browser, atelephone application, an email program, or any other softwareapplication.

In one embodiment, the processor 21 is also configured to communicatewith an array controller 22. In one embodiment, the array controller 22includes a row driver circuit 24 and a column driver circuit 26 thatprovide signals to a pixel array 30. The cross section of the arrayillustrated in FIG. 1 is shown by the lines 1-1 in FIG. 2. For MEMSinterferometric modulators, the row/column actuation protocol may takeadvantage of a hysteresis property of these devices illustrated in FIG.3. It may require, for example, a 10 volt potential difference to causea movable layer to deform from the released state to the actuated state.However, when the voltage is reduced from that value, the movable layermaintains its state as the voltage drops back below 10 volts. In theexemplary embodiment of FIG. 3, the movable layer does not releasecompletely until the voltage drops below 2 volts. There is thus a rangeof voltage, about 3 to 7 V in the example illustrated in FIG. 3, wherethere exists a window of applied voltage within which the device isstable in either the released or actuated state. This is referred toherein as the “hysteresis window” or “stability window.” For a displayarray having the hysteresis characteristics of FIG. 3, the row/columnactuation protocol can be designed such that during row strobing, pixelsin the strobed row that are to be actuated are exposed to a voltagedifference of about 10 volts, and pixels that are to be released areexposed to a voltage difference of close to zero volts. After thestrobe, the pixels are exposed to a steady state voltage difference ofabout 5 volts such that they remain in whatever state the row strobe putthem in. After being written, each pixel sees a potential differencewithin the “stability window” of 3-7 volts in this example. This featuremakes the pixel design illustrated in FIG. 1 stable under the sameapplied voltage conditions in either an actuated or releasedpre-existing state. Since each pixel of the interferometric modulator,whether in the actuated or released state, is essentially a capacitorformed by the fixed and moving reflective layers, this stable state canbe held at a voltage within the hysteresis window with almost no powerdissipation. Essentially no current flows into the pixel if the appliedpotential is fixed.

In typical applications, a display frame may be created by asserting theset of column electrodes in accordance with the desired set of actuatedpixels in the first row. A row pulse is then applied to the row 1electrode, actuating the pixels corresponding to the asserted columnlines. The asserted set of column electrodes is then changed tocorrespond to the desired set of actuated pixels in the second row. Apulse is then applied to the row 2 electrode, actuating the appropriatepixels in row 2 in accordance with the asserted column electrodes. Therow 1 pixels are unaffected by the row 2 pulse, and remain in the statethey were set to during the row 1 pulse. This may be repeated for theentire series of rows in a sequential fashion to produce the frame.Generally, the frames are refreshed and/or updated with new display databy continually repeating this process at some desired number of framesper second. A wide variety of protocols for driving row and columnelectrodes of pixel arrays to produce display frames are also well knownand may be used in conjunction with the present invention.

FIGS. 4 and 5 illustrate one possible actuation protocol for creating adisplay frame on the 3×3 array of FIG. 2. FIG. 4 illustrates a possibleset of column and row voltage levels that may be used for pixelsexhibiting the hysteresis curves of FIG. 3. In the FIG. 4 embodiment,actuating a pixel involves setting the appropriate column to −V_(bias),and the appropriate row to +ΔV, which may correspond to −5 volts and +5volts respectively. Releasing the pixel is accomplished by setting theappropriate column to +V_(bias), and the appropriate row to the same+ΔV, producing a zero volt potential difference across the pixel. Inthose rows where the row voltage is held at zero volts, the pixels arestable in whatever state they were originally in, regardless of whetherthe column is at +V_(bias), or −V_(bias).

FIG. 5B is a timing diagram showing a series of row and column signalsapplied to the 3×3 array of FIG. 2 which will result in the displayarrangement illustrated in FIG. 5A, where actuated pixels arenon-reflective. Prior to writing the frame illustrated in FIG. 5A, thepixels can be in any state, and in this example, all the rows are at 0volts, and all the columns are at +5 volts. With these applied voltages,all pixels are stable in their existing actuated or released states.

In the FIG. 5A frame, pixels (1,1), (1,2), (2,2), (3,2) and (3,3) areactuated. To accomplish this, during a “line time” for row 1, columns 1and 2 are set to −5 volts, and column 3 is set to +5 volts. This doesnot change the state of any pixels, because all the pixels remain in the3-7 volt stability window. Row 1 is then strobed with a pulse that goesfrom 0, up to 5 volts, and back to zero. This actuates the (1,1) and(1,2) pixels and releases the (1,3) pixel. No other pixels in the arrayare affected. To set row 2 as desired, column 2 is set to −5 volts, andcolumns 1 and 3 are set to +5 volts. The same strobe applied to row 2will then actuate pixel (2,2) and release pixels (2,1) and (2,3). Again,no other pixels of the array are affected. Row 3 is similarly set bysetting columns 2 and 3 to −5 volts, and column 1 to +5 volts. The row 3strobe sets the row 3 pixels as shown in FIG. 5A. After writing theframe, the row potentials are zero, and the column potentials can remainat either +5 or −5 volts, and the display is then stable in thearrangement of FIG. 5A. It will be appreciated that the same procedurecan be employed for arrays of dozens or hundreds of rows and columns. Itwill also be appreciated that the timing, sequence, and levels ofvoltages used to perform row and column actuation can be varied widelywithin the general principles outlined above, and the above example isexemplary only, and any actuation voltage method can be used with thepresent invention.

The details of the structure of interferometric modulators that operatein accordance with the principles set forth above may vary widely. Forexample, FIGS. 6A-6C illustrate three different embodiments of themoving mirror structure. FIG. 6A is a cross section of the embodiment ofFIG. 1, where a strip of metal material 14 is deposited on orthogonallyextending supports 18. In FIG. 6B, the moveable reflective material 14is attached to supports at the corners only, on tethers 32. In FIG. 6C,the moveable reflective material 14 is suspended from a deformable layer34. This embodiment has benefits because the structural design andmaterials used for the reflective material 14 can be optimized withrespect to the optical properties, and the structural design andmaterials used for the deformable layer 34 can be optimized with respectto desired mechanical properties. The production of various types ofinterferometric devices is described in a variety of publisheddocuments, including, for example, U.S. Published Application2004/0051929. A wide variety of well known techniques may be used toproduce the above described structures involving a series of materialdeposition, patterning, and etching steps.

FIGS. 7A-7D illustrate certain aspects of the two interferometricmodulator structures described above. FIG. 7A illustrates a simplifiedfunctional diagram of an interferometric modulator 50 in one exemplaryembodiment. The interferometric modulator 50 comprises a substrate 20,an optical dielectric 16 upon the substrate 20, two supports 18 and amirror 14 connected to the supports 18 so as to orient its face in aplane that is parallel to and laterally aligned with the plane of anupper face of the dielectric 16. The minor 14 in FIG. 7A is shown in amechanically relaxed first state so that it reflects incident light whenthe interferometric modulator is seen, e.g., from a viewing position110. The distance between the optical dielectric 16 and the mirror 14 istuned such that only light at a selected wavelength is reflected. Thedetails of the method of selecting the geometries and materials aredescribed in detail in the aforementioned U.S. Pat. No. 5,835,255 andthe aforementioned U.S. patent application Ser. No. 09/966,843, now U.S.Pat. No. 6,867,896. In FIG. 7A, the supports 18, mirror 14, and opticaldielectric 16 define an optical cavity 55.

FIG. 7B illustrates a simplified functional diagram of theinterferometric modulator 50 shown in FIG. 6A where the minor 14 is in asecond state. In FIG. 7B, the minor 14 is moved towards the opticaldielectric layer 16 collapsing the optical cavity 55. The minor 14 ismoved by providing a voltage potential between electrodes coupled to theminor 14 and the optical dielectric 16. By moving the minor 14 to asecond state that is in contact with or in close proximity to theoptical dielectric 16, the optical properties of the interferometricmodulator 50 in the second state are altered from in the first state.Light reflected from the interferometric modulator 50 in the secondstate (FIG. 7B) is a different color than light reflected from theinterferometric modulator 50 in the first state. In one configuration,in the second state the interference of the light is such so that fromthe viewing position 110 the interferometric modulator appears black.

FIGS. 7C and 7D illustrate another embodiment of an interferometricmodulator 60 in a first “open” and a second “closed” state,respectively. This embodiment of the interferometric modulator 60provides an increased usable mirror size as compared to the embodimentshown in FIGS. 7A and 7B. Referring back to FIG. 7B, there are areas ofthe minor 14 which are not providing maximum reflectivity towardsviewing position 110 because they are bending into the collapsed opticalcavity 55. Comparing the minor 34 in FIG. 7D to the mirror 14 in FIG.7B, it can be seen that the mirror 34 in FIG. 7D occupies substantiallythe entire area corresponding to surface area of the optical dielectric16 in the optical cavity 66. In the embodiment shown in FIG. 7D, thereflecting surface of the mirror 34 can be used for the reflection oflight because it is not needed to bend the mirror into the collapsedoptical cavity 66 when the interferometric modulator 60 is actuated. InFIGS. 7C and 7D, the substrate optical dielectric 16, two supports 18and the substrate 20 remain unchanged from the interferometric modulator50 shown in FIGS. 7A and 7B. Details of the structure and fabrication ofthis improved structure can be found in the aforementioned U.S. patentapplication Ser. No. 09/966,843.

FIGS. 8A and 8B illustrate an example of a portion of a display withdisplay elements that can incorporate a conductive mask. FIGS. 8A and 8Billustrate an exemplary portion of a display that includes an array ofinterferometric modulators. A conductive mask can be used in the arrayshown in FIGS. 8A and 8B, and in any type of display where it is usefulto mask off certain areas of the display from ambient light and form anelectrically parallel connection of an electrical circuit in thedisplay. FIG. 8A shows a plurality of pixels 12 of the array. FIG. 8Bshows an example of supports 18 located on the plurality of pixels ofthe array of interferometric modulators that can be masked to improvethe optical response of the display. To improve an optical response(e.g., contrast) of the display, it can be desirable to minimize lightreflected from certain areas of the array. Any area of aninterferometric modulator that increases the reflectance of the displayin the dark state can be masked off (e.g., disposing a mask between thestructure and light entering the interferometric modulator) using ablack mask in order to increase the contrast ratio between an actuatedpixel and an unactuated pixel. Some of the areas that can be masked toadvantageously affect the display include, but are not limited to, rowcuts between interferometric modulators 72 (FIG. 8A), the supports 18,bending areas of the movable minor layers connecting to and/or aroundthe supports 18, and areas between movable minor layers of adjacentinterferometric modulators 76 (FIG. 8A). The mask can be disposed insuch areas so that it is spaced apart from the movable mirror of theinterferometric modulators, e.g., so that ambient light can propagate toand reflect from the movable mirror but the areas other than the movableminor are masked inhibiting ambient light from reflecting from anystructures in the masked areas. These areas that are masked can bereferred to as “non-active areas” because they are static, e.g., theareas do not include the movable mirror. In some embodiment, the maskcan be conductive to minimize reflected light and provide one or moreelectrical paths that can be used for the optical element. In someembodiments, the mask can be disposed so that light entering theinterferometric modulator falls onto either the masked area or themovable mirror. In other embodiments, at least a portion of thenon-active areas are masked.

The rate at which display elements can respond to drive signals candepend on the resistance and capacitance of the control lines (e.g., rowand column electrodes) carrying the drive signals to the displayelements. The desire to view video on large displays and for highresolution displays demands that the resistance of the control lines beminimized. For these reasons, it is desirable to increase theconductance of the signal lines while minimizing the amount ofadditional passive optical contents in a display. One way to decreasethe resistance is to provide one or more electrically parallelconnections to the control lines. A dual-purpose mask can be providedthat increases contrast ratio, and at the same time, acts as a bussinglayer for the driving signals. For example, in one embodiment theconductive mask can be used to form an electrically parallel connectionto one or more row or column electrodes of an array of display elements,for example, interferometric modulators. It will be appreciated that theelectrically parallel connections can be designed in many ways,depending on the application and the type of display elements.

FIG. 9 shows a cross-sectional view of a simplified representation of adisplay 100, according to one embodiment. The display comprises twooptical components which are, in this embodiment, interferometricmodulators 104. As described above, interferometric modulator devices104 comprise an arrangement of reflective films that produce a desiredoptical response when the movable active area is driven towards asubstrate 202 in a direction indicated by arrows 106. The generaloperation of the interferometric modulator devices 104 has beendescribed in U.S. Pat. No. 5,835,255. In FIG. 9, reference numerals 108indicate non-active areas of the interferometric modulators 104.Typically, it is desirable that the non-active areas 108 belight-absorbing or to function as a black mask so that when a viewerlooks at the display 100 from a direction indicated by the viewing arrow110, the optical response produced by the interferometric modulatordevices 104 is not degraded by the reflection of ambient light from thenon-active areas 108. In other embodiments, it can be desirable to maskthe non-active areas 108 with a colored mask (for example, green, red,blue, yellow, etc.) other than black. To gain additional functionalityfrom the mask, the mask can comprise one or more conductive materialswhich can be connected to circuitry in the display 100 and used in wholeor in part to provide one or more electrical busses.

A mask for a non-active area 108 may be fabricated from materialsselected to have an optical response which absorbs or attenuates light.One or more of the materials used to fabricate the mask are electricallyconductive. According to embodiments of the invention, a mask for eachnon-active area 108 can be fabricated as a stack of thin films. Forexample, in one embodiment, the stack of thin films may comprise anon-light-absorbing dielectric layer sandwiched between two lightreflecting chrome layers, as will be more fully described below. Inother embodiments, the non-active areas 108 may comprise a single layerof organic or inorganic materials which attenuates or absorbs light, anda layer of a conductive material such as chrome or aluminum.

FIG. 10 of the drawings shows a cross section through an interferometricmodulator device 200 in accordance with one embodiment of the invention.The interferometric modulator device 200 includes an active componentcomprising an electrode reflective layer 204, an oxide layer 206, an airgap 208, and a mechanical membrane 210 disposed on a substrate 202. Asused herein, the phrase “disposed on a substrate” is a broad phrase, andit indicates, for example that a referenced structure, layer, opticaldevice, interferometric modulator, bi-stable device, electrode, filmstack, support, electrode, mask or other referred to feature is locatedon a substrate, and can but does not necessarily require direct contactwith the substrate, unless so indicated. The mechanical membrane 210 issupported in position by supports 212. In use, the mechanical membrane210 is driven to contact the oxide layer 206 to produce a desiredoptical response when viewed from the direction indicated by arrow 110.

The supports 212, the areas of the interferometric modulator 200 onwhich the supports 212 are formed, and other areas that are not part ofthe active component of the interferometric modulator (for example,areas indicated by encircled areas 230) can be masked with a conductivemask to prevent or reduce the reflection of light from these areas whichcan otherwise interfere with the desired optical response of the activeinterferometric modulator components. The mask can be fabricated as astack of films, including at least one electrically conducting film,selected so that the stack has the optical property of beinglight-absorbing and conductive, according to one embodiment. The maskcan be formed on the substrate 202 prior to forming the active opticalcomponents of the interferometric modulators, according to oneembodiment. The supports 212 of the interferometric modulator 200 canperform several functions. First, the supports 212 function asmechanical supports for the movable mechanical membrane 210. Second, thesupports 212 can provide an electrical connection for the conductivemask, if the supports 212 comprise an electrically conductive material.For example, when a support 212 is connected to a conductive layer 222the support 212 and the conductive layer 222 can provide one or moreelectrical paths to apply voltages to the movable mechanical membrane210, as will be illustrated in following FIGS. 17-18, and 20-22.

As shown in FIG. 10 the interferometric modulator 200 includes aconductive mask that comprises a stack of thin films. In one embodiment,the mask comprises a first reflective chrome layer 218, an oxide middlelayer 220 and a second reflective chrome layer 222. Other conductivematerials can also be used to form the mask. For example, in anotherembodiment, the mask includes a stack of thin films comprising a chromelayer 218, an oxide middle layer 220 (for example, SiO₂), and analuminum layer 222. The interferometric modulator 200 includes anotheroxide layer 226 between the oxide middle layer 220 and the electrodereflective layer 204. One or more electrically conductive layers of themask can be connected other components of the interferometric modulator200 to provide an electrical bus. For example, the mask can be connectedto one or more column or row electrodes. In one embodiment, chrome layer222 is connected to the electrode reflective layer 204 by vias 224 thatcomprise an electrically conductive material. The connections requiredin the configuration of the conductive mask so that it functions as anelectrical bus can depend on the particular application. In someembodiments, the electrode reflective layer 204 includes electricalseparators 228 (for example, gaps or non-conductive material) located invarious positions to electrically separate conductive portions of theinterferometric modulator, for example, the electrode reflective layer204 or the supports 212, and suitably configure the mask to exhibit thedesired bus functionality.

One embodiment of fabricating a conductive mask is disclosed below inreference to FIGS. 11-17. FIG. 11 is a cross-sectional view illustratingvarious layers that can be included in a MEMS device, for example theMEMS device shown in FIG. 1, having a conductive mask 402. Only aportion of the MEMS device that includes the conductive mask 402 isshown in FIG. 11, the remaining portion of the MEMS device beingindicated by the dashed rectangle 203. The conductive mask 402,indicated by the dashed circles, is illustrated as being fabricated on asubstrate 202. The mask 402 comprises three layers of film, including afirst reflective layer 218, an oxide layer 220 and a second reflectivelayer 222. The first reflective layer 218 and the second reflectivelayer 222 can comprise materials that are both reflective andconductive, for example, chrome, aluminum, or silver. For someembodiments, the conductive mask 402 can be structured as a staticinterferometric modulator that is configured so that it minimizesreflected light, e.g., appears black. In other embodiments, theconductive mask 402 can be structured as a static interferometricmodulator that reflects light of a selected color. The films which makeup the conductive mask 402 can be the same films which are used in thefabrication of the interferometric modulator components, thus making itpossible to use the same deposition parameters to fabricate the mask andthe interferometric modulator components. The conductive mask 402 can beused to provide greater flexibility in the routing of electrical signalsaround the display device and help minimize resistance of electricalcircuits providing signals to the interferometric electrodes byproviding electrically parallel connections for the signals.

The various stages in the manufacture of a conductive mask 402 and theMEMS device will now be described with reference to FIGS. 12-17.

FIG. 12 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating a first reflectivemask layer 218 deposited on a substrate 202. After an initialpreparatory step wherein the substrate 202 is prepared, for example,cleaned, a first reflective mask layer 218 is deposited by sputtercoating it onto substrate 202, according to one embodiment. In oneexemplary embodiment, the thickness of first reflective mask layer 218can be about 60 angstroms.

FIG. 13 is a cross-sectional view of a stage in the manufacture of theMEMS device having a conductive mask illustrating the first reflectivemask layer 218 of FIG. 12 with certain portions removed. For thisfabrication, after the first reflective mask layer 218 is deposited, asshown in FIG. 12, the first reflective mask layer 218 is patterned anddeveloped using conventional techniques to leave two or more portions oroutcrops of chrome, which can serve as a base layer for a thin filmstack which serves as a mask.

FIG. 14 is a cross-sectional view of a stage in the manufacture of theMEMS device having a conductive mask illustrating additional layers thatare fabricated on the embodiment shown in FIG. 13. As shown in FIG. 14,an oxide layer 220 is deposited on the substrate 202 covering the firstreflective mask layer 218. In one embodiment the oxide layer 220 isabout 300 to 800 angstroms in depth. This layer can be applied bysputter coating the SiO₂ onto the embodiment shown in FIG. 14. Thethickness of the oxide layer 220 can depend on the quality of the color(e.g., black) state that is required for the mask, and it can alsodepend on the desired color of the mask.

A second reflective layer 222 is deposited on the oxide layer 220, andthe second reflective layer 222 is patterned and developed to formportions that correspond to the first reflective layer 218, forming aconductive mask comprising a thin film stack. Then an oxide layer 226 isdeposited on the second reflective layer 222. Vias 224 can be formed inthe oxide layer 226 so the second reflective layer 222 can be connectedto a support 212, for example, as shown in FIG. 16. Electricalseparators 228 can be formed in the electrode reflective layer 204,which is deposited on the oxide layer 226. The electrode reflectivelayer 204 is typically about 60 angstroms thick, its exact thicknessbeing dependent on the required brightness of the ultimate display, athinner layer yielding a brighter display. Based on the desiredconfiguration and the utilization of the conductive mask, portions ofthe electrodes, for example, the electrode reflective layer 204, can beelectrically separated by forming one or more separations 228 in theelectrode reflective layer 204.

Thereafter, an oxide layer 206 and a sacrificial layer 209 arerespectively sputter coated on to electrode reflective layer 204. Theoxide layer 206 can comprise silicon oxide and can be about 300 to 800angstroms thick, according to one embodiment. The sacrificial layer 209can comprise comprising molybdenum and can typically be about 0.2 to 1.2microns thick, according to one embodiment.

FIG. 15 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating a patterning and etchstep performed to form the recesses for supports. The patterning and anetching step is performed to form recesses which extend through theoxide layer 226 to the vias 224 and the second reflective layer 222,according to this embodiment. The vias 224 can be formed in the oxidelayer 226 so the second reflective layer 222 can be connected to asupport 212 (shown in FIG. 16). To form an electrical connection betweenthe second reflective layer 222 of the conductive mask and another partof the MEMS device (e.g., the mechanical membrane 210 shown in FIG. 17)the support 212 can extend through the vias 224 to the second reflectivelayer 222, according to one embodiment. In another embodiment, the vias224 are formed in the oxide layer 226 and are filled with anelectrically conductive material which is connected to the support.

FIG. 16 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask illustrating forming supports 212in the recesses shown in FIG. 15. The supports 212 provide a structurethat supports the movable mechanical membrane 210 (FIG. 17), and can beformed in the recesses by spinning a negative photoresist material overthe thin film stack, exposing it through a suitable mask and developingit to form the supports 212. In this embodiment, electrical separators228 isolate the supports 212 from the electrode reflective layer 204.Such separators 228 can be used to isolate the support 212 from theelectrode reflective layer 204 when the support 212 comprises aconductive material.

FIG. 17 is a cross-sectional view of a stage in the manufacture of aMEMS device having a conductive mask, illustrating a mechanical membrane210 deposited onto the embodiment shown in FIG. 16. The mechanicalmembrane 210 is deposited by sputter coating it onto the sacrificiallayer 209. Thereafter, the sacrificial layer 209 is removed leaving anair gap 208. In one embodiment, the mechanical membrane 210 comprises analuminum alloy. With the removal of the sacrificial layer 209, an airgap 208 is formed through which the mechanical membrane 516 moves whenthe interferometric modulator is actuated.

FIG. 17 also shows an embodiment of an electrical connection between thesecond reflective layer 222, the supports 212, and the mechanicalmembrane 210. Here, the conductive mask includes a dielectric stack thatcomprises a first reflective layer 218, an oxide layer 220, and a secondreflective layer 222, that masks off non-active areas (for example, thesupports 212) spaced apart from the active areas. In some embodiments,the conductive mask can comprise chrome, silver, aluminum or adielectric stack so that one or more of the materials used to form themask is capable of conducting electricity.

In this embodiment, the mask is a non-movable (e.g., static)interferometric element configured such that it causes the interferenceof light so that it reflects minimal light and appears black. Theoptical layer can be formed from ITO/Cr, ITO/Mo, ITO/Ti, Cr, Mo, Ti orother materials with similar properties. The dielectric layer istypically formed from SiO₂ or other dielectric materials, and thereflector is typically formed from aluminum, chromium or other metallicmaterials.

By fabricating the mask so that it comprises an electrically conductivematerial and using appropriately placed connections to a desired rowand/or column electrode the mask can be used to reduce the resistance ofthe row and/or column electrode. For example, if a conductive mask,configured to always display black, is used in an array comprising aplurality of interferometric modulators, the conductive mask can be alsobe used as a conduction layer to decrease resistance of row and/orcolumn electrodes that are used in the array to carry signals to thedisplay elements aligned in rows and/or columns. In this embodiment,vias were created in the dielectric 226 to provide a recess for thesupport 212 and so it can connect to the second reflective layer 222,which is part of the conductive mask. It will be appreciated that thereare many other possible embodiments to utilize a conductive mask. Insome embodiments where the mask comprises a first conductive layer 218and a second conductive layer 222, both conductive layers can be used asan electrical bus. In some embodiments, both conductive layers can beused as part of the same electrical bus. In other embodiments, theconductive layers are each used as part of separate electrical bus.

FIGS. 18-22 show various exemplary embodiments of a conductive mask inan interferometric modulator to provide an electrically parallelconnection to an electrode. The embodiments can be fabricated usingsimilar techniques as described hereinabove for the embodiment shown inFIG. 17. The conductive masks illustrated in FIGS. 18-22 are configuredas non-movable interferometric elements, that provide one or moreelectrically paralleled connections for application of voltages to themodulating element. FIG. 18 is a cross-sectional view of a MEMS deviceillustrating an embodiment of a conductive mask where an electricallyparallel connection is formed between both layers of the mask and amovable mechanical membrane. In FIG. 18, the mask comprises the firstreflective layer 218 and the second reflective layer 222. The mask formsan electrically parallel connection to the mechanical membrane 210, aportion of one of the electrodes in the interferometric modulator, asindicated by the diagonally-lined areas. The first reflective layer 218is electrically connected to the second reflective layer 222 byconnectors 229. The supports 212 are made of a conductive material, forexample, one of the conductive materials described herein, and areconnected to the second reflective layer 222. Electrical separators 228electrically isolate the supports 212 from the electrode reflectivelayer 204. The supports 212 are connected to the movable mechanicalmembrane 210 so that the first reflective layer 218 and the secondreflective layer 222 form an electrically parallel connection with themechanical membrane 210.

FIG. 19 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between two conductive layers of a mask and thenon-movable electrode layer 204. The first reflective layer 218 and thesecond reflective layer 222 form an electrically parallel connection tothe electrode reflective layer 204, as indicated by the diagonally-linedareas. The first reflective layer 218 is electrically connected to thesecond reflective layer 222 by connectors 231, which also connect thefirst reflective layer 218 and the second reflective layer 222 to theelectrode reflective layer 204. Electrical separators 228 electricallyisolate the supports 212 from the electrode reflective layer 204.

FIG. 20 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between a first reflective layer 218 of the maskand the movable mechanical membrane 210. The first reflective layer 218of the mask is electrically connected to the mechanical membrane 210 bythe conductive connector 234 which runs through the support 212. Theconnector 234 is isolated from the support 212 and the second reflectivelayer 222 of the mask by electrical isolators 232, which are formed froma non-conductive material. Electrical isolators 228 isolate the support212 from the electrode reflective layer 204. In embodiments where thesupport 212 is not formed from a conductive material, electricalisolators 232 and electrical isolators 228 may not be necessary toelectrically isolate the support 212 from surrounding conductivematerial. In this embodiment, only the first reflective layer 218 formsan electrically parallel connection to the mechanical membrane 210.

FIG. 21 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between a first reflective layer 218, a secondreflective layer 222 of the mask and a movable mechanical membrane 210.This embodiment is similar to the embodiment shown in FIG. 21, exceptthat the first reflective layer 218 is connected to the secondreflective layer 222 by the electrical connector 238. The firstreflective layer 218 and the second reflective layer 222 areelectrically connected to the mechanical membrane 210 by electricalconnector 236, forming an electrical parallel connection between bothlayers of the conductive mask and the mechanical membrane 210. In thisembodiment, the support 212 is not formed from a conductive material,thus isolators 232, although shown for clarity, would not be necessaryto electrically isolate the support 212 from surrounding conductivematerial.

FIG. 22 is a cross-sectional view of a MEMS device illustrating anembodiment of a conductive mask where an electrically parallelconnection is formed between a first reflective layer 218 of the maskand the electrode layer 204, as indicated by the diagonally lined areas.Another electrically parallel connection is formed between a secondreflective layer of the mask 222 and a movable mechanical membrane 210,as indicated by the cross-hatched areas. In FIG. 22, the firstelectrically parallel connection is formed by electrically connectingthe first reflective layer 218 of the mask to the electrode layer 204 byelectrical connectors 240. Electrical isolators 228 isolate theelectrode layer 204 from the conductive support 212. Electricalisolators 233 isolate the electrical connector 240 from the secondreflective layer 222 of the mask. The second electrically parallelconnection is formed by connecting the second reflective layer 222 ofthe mask to the support 212, which is connected to the mechanicalmembrane 210.

While the above detailed description has shown, described, and pointedout novel features of the invention as applied to various embodiments,it will be understood that various omissions, substitutions, and changesin the form and details of the device or process illustrated may be madeby those skilled in the art without departing from the spirit of theinvention. The scope of the invention is indicated by the appendedclaims rather than by the foregoing description. All changes which comewithin the meaning and range of equivalency of the claims are to beembraced within their scope.

1.-32. (canceled)
 33. An electromechanical device comprising: a lightmodulating element including: a movable reflective element, and anactuation electrode, the movable reflective element responsive to avoltage applied to the actuation electrode by moving from a firstposition to a second position; and a support mechanically coupled to themovable reflective element; and an optical mask at least partially underthe support, the optical mask including: a first conductive layer, and asecond conductive layer spaced from and under the first reflectivelayer, the first conductive layer electrically coupled to at least oneof the movable reflective element and the actuation electrode.
 34. Thedevice of claim 33, wherein the first conductive layer is electricallycoupled to the movable reflective element through the support.
 35. Thedevice of claim 34, wherein the support includes: a dielectric material;and a connector through the dielectric material, the connectorelectrically coupled to the first conductive layer and the movablereflective element.
 36. The device of claim 35, wherein the connectorincludes a conductive via.
 37. The device of claim 35, furthercomprising another connector electrically coupled to the firstconductive layer and the second conductive layer.
 38. The device ofclaim 37, wherein the another connector is aligned with the connector.39. The device of claim 34, wherein the support includes a conductivematerial.
 40. The device of claim 39, further comprising a connectorelectrically coupled to the first conductive layer and the secondconductive layer.
 41. The device of claim 39, further comprisingdielectric material between the conductive material of the support andthe actuation electrode.
 42. The device of claim 33, wherein the firstconductive layer is electrically coupled to the actuation electrode. 43.The device of claim 42, further comprising a connector electricallycoupled to the first conductive layer and the second conductive layer.44. The device of claim 33, wherein the light modulating elementincludes a mechanical membrane including the movable reflective element.45. The device of claim 33, wherein the second conductive layer isspaced from the first reflective layer by a dielectric layer.
 46. Thedevice of claim 33, wherein the optical mask is configured to appearblack.
 47. The device of claim 33, wherein the optical mask isconfigured to appear a color other than black.
 48. The device of claim33, wherein the light modulating element is viewable from an under sideof the device.
 49. The device of claim 48, wherein the actuationelectrode is between the movable reflective element and the under sideof the device.
 50. The device of claim 33, wherein the first conductivelayer includes at least one of aluminum and silver.
 51. The device ofclaim 33, wherein the second conductive layer includes at least one ofchromium and molybdenum.
 52. The device of claim 33, wherein the lightmodulating element is an interferometric modulator.
 53. Anelectromechanical device comprising: means for modulating light, themeans for modulating light including: movable means for reflectinglight, and means for moving the movable means for reflecting light, themovable means for reflecting light responsive to a voltage applied tothe means for moving the movable means for reflecting light by movingfrom a first position to a second position; means for supporting themovable means for reflecting light, the means for supporting the movablemeans for reflecting light mechanically coupled to the movable means forreflecting light; and means for reducing light, the means for reducinglight at least partially under the means for supporting the movablemeans for reflecting light, the means for reducing light including:first means for reflecting light, and second means for reflecting light,the second means for reflecting light spaced from and under the firstmeans for reflecting light, the first means for reflecting lightelectrically coupled to at least one of the movable means for reflectinglight and the means for moving the movable means for reflecting light.54. The device of claim 53, wherein the means for modulating lightincludes a light modulating element, or wherein the movable means forreflecting light includes a movable reflective element, or wherein themeans for moving the movable means for reflecting light includes anactuation electrode, or wherein the means for supporting the movablemeans for reflecting light includes a support, or wherein the means forreducing light includes an optical mask, or wherein the first means forreflecting light includes a first conductive layer, or wherein thesecond means for reflecting light includes a second conductive layer.55. The device of claim 53, wherein the first means for reflecting lightis electrically coupled to the movable means for reflecting lightthrough the means for supporting the movable means for reflecting light.56. The device of claim 55, wherein the means for supporting the movablemeans for reflecting light includes: a dielectric material; and aconnector through the dielectric material, the connector electricallycoupled to the first means for reflecting light and the movable meansfor reflecting light.
 57. The device of claim 55, wherein the means forsupporting the movable means for reflecting light includes a conductivematerial.
 58. The device of claim 53, wherein the first means forreflecting light is electrically coupled to the means for moving themovable means for reflecting light.
 59. The device of claim 53, furthercomprising means for electrically connecting the first means forreflecting light and the second means for reflecting light.
 60. Thedevice of claim 59, wherein the means for electrically connecting thefirst means for reflecting light and the second means for reflectinglight includes a connector.
 61. The device of claim 53, wherein thesecond means for reflecting light is spaced from the first means forreflecting light by a dielectric layer.
 62. The device of claim 53,wherein the means for moving the movable means for reflecting light isbetween the movable means for reflecting light and an under side of thedevice.
 63. A method of manufacturing an electromechanical device, themethod comprising: forming an optical mask, wherein forming the opticalmask includes: forming a first conductive layer, and forming a secondconductive layer, the second conductive layer spaced from and under thefirst conductive layer; forming a support, the optical mask at leastpartially under the support; forming a light modulating element, whereinforming the light modulating element includes: forming a movablereflective element, the support mechanically coupled to the movablereflective element, and forming an actuation electrode, the movablereflective element responsive to a voltage applied to the actuationelectrode by moving from a first position to a second position; andelectrically connecting the first conductive layer to at least one ofthe movable reflective element and the actuation electrode.
 64. Themethod of claim 63, wherein electrically connecting the first conductivelayer to at least one of the movable reflective element and theactuation electrode includes electrically connecting the firstconductive layer to the movable reflective element through the support.65. The method of claim 64, wherein forming the support includes:forming a dielectric material, and forming a connector through thedielectric material, wherein electrically connecting the firstconductive layer to the movable reflective element through the supportincludes electrically connecting the connector to the first conductivelayer and the movable reflective element.
 66. The method of claim 64,wherein forming the support includes forming a conductive material. 67.The method of claim 63, wherein electrically connecting the firstconductive layer to at least one of the movable reflective element andthe actuation electrode includes electrically connecting the firstconductive layer to the actuation electrode.
 68. The method of claim 63,further comprising electrically connecting a connector to the firstconductive layer and the second conductive layer.
 69. The method ofclaim 63, wherein forming the optical mask includes forming a dielectriclayer between the second conductive layer and the first reflectivelayer.
 70. The method of claim 63, wherein forming the actuationelectrode includes forming the actuation electrode between the movablereflective element and an under side of the device.